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IRFI4227PBF - Infineon

Description: HEXFET N-Ch MOSFET 26A 200V PDP TO220FP International Rectifier IRFI4227PBF N-channel MOSFET Transistor, 26 A, 200 V, 3-Pin TO-220FP

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PCB Footprints
IRFI4227PBF - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB Full-Pak
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3D Models
IRFI4227PBF - Infineon  - 3D model - Transistor Outline, Vertical - TO-220AB Full-Pak
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IRFI4227PBF Details

  • Manufacturer Part Number:

    IRFI4227PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    54 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    26 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    46 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFI4227PBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRFI4227PBF is -55°C to 175°C.
  • To ensure reliability, follow proper thermal management, use a suitable heat sink, and ensure the device is operated within its specified ratings and guidelines.
  • A good PCB layout should provide a low-thermal-resistance path from the device to the heat sink, and ensure good thermal conduction. Consult the application note and Infineon's thermal design guidelines for more information.
  • Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) mechanism, such as a fuse or a current-sensing resistor, to prevent damage from voltage and current surges.
  • Handle the device with ESD-protective equipment, follow proper ESD handling procedures, and ensure the device is stored in an ESD-protective package to prevent damage.

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