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IRFS7730TRL7PP - Infineon

Description: MOSFET 75V Single N-Channel HEXFET

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PCB Footprints
IRFS7730TRL7PP - Infineon PCB footprint - Other - Other - PG-TO263-7-900
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3D Models
IRFS7730TRL7PP - Infineon  - 3D model - Other - PG-TO263-7-900
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IRFS7730TRL7PP Details

  • Manufacturer Part Number:

    IRFS7730TRL7PP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-7/6

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    897 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    75 V

  • Drain Current-Max (ID):

    269 A

  • Drain-source On Resistance-Max:

    0.002 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    720 pF

  • JEDEC-95 Code:

    TO-263CB

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    375 W

  • Pulsed Drain Current-Max (IDM):

    990 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFS7730TRL7PP Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRFS7730TRL7PP is -55°C to 175°C.
  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure reliable operation in high-humidity environments, it is recommended to use a conformal coating on the PCB and ensure that the device is properly sealed to prevent moisture ingress.
  • The recommended soldering conditions for the IRFS7730TRL7PP are a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C.
  • To handle ESD protection for the IRFS7730TRL7PP, it is recommended to use an ESD protection device, such as a TVS diode, and follow proper handling and storage procedures to prevent ESD damage.

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IRFS7730TRL7PP Overview

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