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IRL6372TRPBF - Infineon

Description: IRL6372TRPBF Dual N-Channel MOSFET, 8.1 A, 30 V HEXFET, 8-Pin SOIC Infineon

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IRL6372TRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - IRF6216TRPBF
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IRL6372TRPBF - Infineon  - 3D model - Small Outline Packages - IRF6216TRPBF
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IRL6372TRPBF Details

  • Manufacturer Part Number:

    IRL6372TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8.1 A

  • Drain-source On Resistance-Max:

    0.0179 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    68 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    65 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRL6372TRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRL6372TRPBF is -55°C to 150°C.
  • To ensure reliability, follow proper thermal management, use a suitable heat sink, and ensure the device is operated within the recommended voltage and current ratings.
  • Use a multi-layer PCB with a solid ground plane, keep high-current paths short and wide, and use shielding or filtering to minimize EMI.
  • Yes, the IRL6372TRPBF is suitable for high-frequency switching applications up to 1 MHz, but ensure proper PCB layout and decoupling to minimize ringing and oscillations.
  • Use a voltage regulator or overvoltage protection circuit, and consider adding current-sensing resistors and overcurrent protection devices to prevent damage.

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