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IRLML2244TRPBF - Infineon

Description: INFINEON - IRLML2244TRPBF - P CHANNEL POWER MOSFET, HEXFET, -20V, -4.3A, SOT-23

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PCB Footprints
IRLML2244TRPBF - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - IRF7401PBF
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3D Models
IRLML2244TRPBF - Infineon  - 3D model - SOT23 (3-Pin) - IRF7401PBF
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IRLML2244TRPBF Details

  • Manufacturer Part Number:

    IRLML2244TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    4.3 A

  • Drain-source On Resistance-Max:

    0.054 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    110 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    1.3 W

  • Power Dissipation-Max (Abs):

    1.3 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRLML2244TRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRLML2244TRPBF is -55°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing power dissipation.
  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout, including using a solid ground plane, minimizing trace lengths, and using a low-ESR capacitor for decoupling.
  • To prevent ESD damage, it's essential to follow proper handling and storage procedures, such as using ESD-safe materials, grounding oneself before handling the device, and using ESD protection devices in the circuit.
  • The recommended gate drive circuits for the IRLML2244TRPBF include using a dedicated gate driver IC, such as the Infineon ICE2QS01G, and following proper layout and design guidelines to minimize ringing and overshoot.

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