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IRLMS2002TRPBF - Infineon

Description: HEXFET N-Ch MOSFET 6.5A 20V Micro6 International Rectifier IRLMS2002TRPBF N-channel MOSFET Transistor, 6.5 A, 20 V, 6-Pin Micro6

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PCB Footprints
IRLMS2002TRPBF - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - Micro6 (SOT23 6L) Package Outline
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3D Models
IRLMS2002TRPBF - Infineon  - 3D model - SOT23 (6-Pin) - Micro6 (SOT23 6L) Package Outline
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IRLMS2002TRPBF Details

  • Manufacturer Part Number:

    IRLMS2002TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICRO-6

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    6.5 A

  • Drain-source On Resistance-Max:

    0.03 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRLMS2002TRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRLMS2002TRPBF is -55°C to 150°C.
  • To ensure reliability, follow proper thermal management, use a suitable heat sink, and ensure the device is operated within its specified ratings and guidelines.
  • Follow Infineon's recommended PCB layout and thermal design guidelines, which include using a multi-layer PCB, thermal vias, and a heat sink to ensure efficient heat dissipation.
  • Handle the device with ESD-protective equipment, use an ESD wrist strap, and follow proper ESD handling procedures to prevent damage.
  • Use a gate drive circuit that provides a high current, fast rise time, and a voltage level compatible with the device's gate-source voltage rating.

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