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IRS2004PBF - Infineon

Description: Infineon IRS2004PBF Dual MOSFET Power Driver, 0.6A Half Bridge, 10 → 20 V 8-Pin, PDIP

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PCB Footprints
IRS2004PBF - Infineon PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead PDIP
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3D Models
IRS2004PBF - Infineon  - 3D model - Dual-In-Line Packages - 8-Lead PDIP
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IRS2004PBF Details

  • Manufacturer Part Number:

    IRS2004PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

IRS2004PBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRS2004PBF is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate within -20°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet. Typically, this includes a VCC supply voltage of 15V, a VBS supply voltage of 12V, and a maximum output current of 200mA. Additionally, ensure that the input and output pins are properly decoupled and filtered to minimize noise and oscillations.
  • For optimal thermal management, ensure that the IRS2004PBF is mounted on a PCB with a solid copper ground plane and adequate thermal vias. Keep the component away from heat sources and ensure good airflow around the device. A recommended PCB layout is provided in the datasheet, which includes guidelines for component placement, trace routing, and thermal management.
  • To troubleshoot common issues, start by verifying the power supply and biasing conditions. Check for proper decoupling and filtering of the input and output pins. Ensure that the PCB layout and thermal management are adequate. If issues persist, consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.
  • Yes, the IRS2004PBF is a high-frequency device and requires careful consideration of EMI and EMC. Ensure that the PCB layout and component placement minimize radiation and susceptibility to electromagnetic interference. Follow recommended guidelines for shielding, grounding, and filtering to ensure compliance with relevant EMI and EMC standards.

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IRS2004PBF Overview

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