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IRS21064STRPBF - Infineon

Description: INFINEON - IRS21064STRPBF - MOSFET/IGBT DRIVER, HIGH/LOW SIDE, NSOIC

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IRS21064STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead SOIC
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IRS21064STRPBF - Infineon  - 3D model - Small Outline Packages - 14-Lead SOIC
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IRS21064STRPBF Details

  • Manufacturer Part Number:

    IRS21064STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.15

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.3 µs

  • Width:

    3.9 mm

IRS21064STRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate for efficient heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • The maximum allowed voltage on the bootstrap capacitor is 35V. Exceeding this voltage may damage the device.
  • Use a shielded enclosure, keep the layout compact, and use a common-mode choke or ferrite bead to filter the input and output lines. Also, ensure proper grounding and decoupling.
  • A 10uF to 22uF ceramic or film capacitor with a voltage rating of 50V or higher is recommended. The capacitor should be placed close to the device and connected between the input pins.

Trust Checks

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IRS21064STRPBF Overview

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Part Image IRS21064SPBF Infineon Technologies AG

Half Bridge Based IGBT/MOSFET Driver, 0.6A, CMOS, PDSO14