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IRS21091SPBF - Infineon

Description: Infineon IRS21091SPBF Dual Half Bridge MOSFET Power Driver 0.6A, 10 → 20 V, Non-Inverting, SOIC 8-Pin

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IRS21091SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOIC
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IRS21091SPBF - Infineon  - 3D model - Small Outline Packages - 8-Lead SOIC
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IRS21091SPBF Details

  • Manufacturer Part Number:

    IRS21091SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.6 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.95 µs

  • Width:

    3.9 mm

IRS21091SPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended thermal design guidelines. Also, consider using a thermal interface material (TIM) between the device and the heat sink.
  • The maximum allowed voltage on the bootstrap capacitor is 35V. Exceeding this voltage may damage the device.
  • Use a dead-time generator or a dedicated IC with built-in dead-time control to prevent shoot-through currents. Also, ensure proper synchronization of the high-side and low-side gate drivers.
  • A gate resistance of 10-20 ohms is recommended for optimal switching performance. Higher gate resistances may lead to slower switching times and increased power losses.

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