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IRS21094SPBF - Infineon

Description: INFINEON - IRS21094SPBF - Dual MOSFET Driver, Half Bridge, 10V-20V Supply, 600mA Out, 200ns Delay, SOIC-14

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IRS21094SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead SOIC
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IRS21094SPBF - Infineon  - 3D model - Small Outline Packages - 14-Lead SOIC
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IRS21094SPBF Details

  • Manufacturer Part Number:

    IRS21094SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012AB, SOIC-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.95 µs

  • Width:

    3.9 mm

IRS21094SPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the IRS21094SPBF involves keeping the high-frequency switching nodes (e.g., VCC, VIN, and SW) as close to the IC as possible, using a solid ground plane, and minimizing the length of the high-current paths. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a solid ground plane to reduce EMI and improve thermal performance.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the IC and the heat sink. The heat sink should be designed to dissipate the maximum power loss of the IC, which can be calculated using the datasheet's thermal resistance and power loss equations. Additionally, ensure good airflow around the heat sink to facilitate convection cooling.
  • When selecting input and output capacitors for the IRS21094SPBF, consider the following factors: capacitance value, voltage rating, ESR, and ripple current rating. Choose capacitors with low ESR and high ripple current ratings to minimize losses and ensure reliable operation. Additionally, ensure the capacitors are rated for the maximum input voltage and can handle the expected ripple current.
  • To troubleshoot common issues with the IRS21094SPBF, start by checking the input voltage and output voltage levels using an oscilloscope or multimeter. Verify that the input voltage is within the recommended range and that the output voltage is within the specified tolerance. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for specific troubleshooting guidelines and fault detection methods.
  • The IRS21094SPBF and IRS2106SPBF are both high-voltage, high-frequency half-bridge drivers, but they have some key differences. The IRS21094SPBF has a higher maximum output voltage (600V vs. 500V) and a higher maximum switching frequency (1MHz vs. 500kHz). The IRS21094SPBF also has a more advanced protection feature set, including overvoltage, undervoltage, and overtemperature protection. Consult the datasheets for a detailed comparison of the two ICs.

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