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IRS21094STRPBF - Infineon

Description: Driver 600V 0.6A 2-OUT High and Low Side Half Brdg Inv/Non-Inv 14-Pin SOIC N T/R

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IRS21094STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead SOIC
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IRS21094STRPBF Details

  • Manufacturer Part Number:

    IRS21094STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012AB, SOIC-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.95 µs

  • Width:

    3.9 mm

IRS21094STRPBF Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN-1071, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure proper airflow. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms.
  • Infineon provides recommended gate drive circuits in the application note AN-978, which includes schematics and component values for various gate drive configurations. It's essential to follow these recommendations to ensure proper device operation and minimize electromagnetic interference (EMI).
  • Infineon provides a troubleshooting guide in the application note AN-1105, which covers common issues, such as overcurrent, overvoltage, and overheating, and provides guidance on how to identify and resolve these issues.
  • Using a different gate drive voltage than the recommended 15V may affect the device's performance, reliability, and EMI characteristics. It's essential to consult the datasheet and application notes to understand the implications of using a different gate drive voltage and ensure that the device operates within its specified parameters.

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Part Image IRS21094SPBF Infineon Technologies AG

Half Bridge Based IGBT/MOSFET Driver, 0.6A, CMOS, PDSO14