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IRS2109SPBF - Infineon

Description: Infineon IRS2109SPBF Dual Half Bridge MOSFET Power Driver 0.6A, 10 → 20 V, Non-Inverting, SOIC 8-Pin

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IRS2109SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IRS2109SPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IRS2109SPBF Details

  • Manufacturer Part Number:

    IRS2109SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.95 µs

  • Width:

    3.9 mm

IRS2109SPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IRS2109SPBF is 600 kHz, but it can be adjusted up to 1 MHz with an external resistor.
  • To ensure the bootstrap capacitor is properly charged, make sure the VCC pin is powered up before the input voltage (VIN) is applied, and the bootstrap capacitor should be at least 10nF with a low ESR.
  • The SD (Shutdown) pin is used to put the device into a low-power state. To use it, simply pull the SD pin low to shut down the device, and pull it high to resume normal operation.
  • The minimum input capacitance can be calculated using the formula: CIN(min) = (IOUT x ΔVIN) / (fSW x ΔVOUT), where IOUT is the output current, ΔVIN is the input voltage ripple, fSW is the switching frequency, and ΔVOUT is the output voltage ripple.
  • For optimal performance and thermal management, it is recommended to follow a compact layout with short traces, use a thermal pad on the PCB, and ensure good airflow around the device.

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IRS2109SPBF Overview

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