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IRS2111STRPBF - Infineon

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IRS2111STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IRS2111STRPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IRS2111STRPBF Details

  • Manufacturer Part Number:

    IRS2111STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.18 µs

  • Turn-on Time:

    0.95 µs

  • Width:

    3.9 mm

IRS2111STRPBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the IRS2111STRPBF involves keeping the high-frequency switching nodes (e.g., bootstrap capacitor and high-side FET) as close as possible to the IC, using a solid ground plane, and minimizing the length of the high-current paths. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • When selecting the bootstrap capacitor, consider the following factors: voltage rating, capacitance value, ESR, and physical size. A capacitor with a high voltage rating (e.g., 25V or higher) and a low ESR (e.g., < 1 ohm) is recommended. The capacitance value should be sufficient to support the high-side FET's gate charge requirements. A ceramic or film capacitor with a small physical size is preferred due to its low ESL and high reliability.
  • To troubleshoot issues with the IRS2111STRPBF, start by verifying the power supply voltage, input signals, and output waveforms. Check for proper PCB layout, component selection, and soldering quality. Use an oscilloscope to monitor the gate-source voltage, drain-source voltage, and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting common issues, such as overvoltage, undervoltage, and overcurrent protection.
  • Operating the IRS2111STRPBF at a lower frequency than the recommended 100 kHz may result in reduced efficiency, increased heat generation, and potential instability. The device's internal oscillator and voltage regulator may not function optimally at lower frequencies, leading to reduced performance and reliability. If a lower frequency is required, consult the datasheet and application notes for guidance on component selection and design considerations.

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