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IRS21531DSTRPBF - Infineon

Description: Driver 600V 0.26A 2-OUT Hi/Lo Side Half Brdg Inv/Non-Inv 8-Pin SOIC T/R

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IRS21531DSTRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC-ren1
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IRS21531DSTRPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC-ren1
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IRS21531DSTRPBF Details

  • Manufacturer Part Number:

    IRS21531DSTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.26 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    15.4 V

  • Supply Voltage-Min:

    10.1 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.35 µs

  • Width:

    3.9 mm

IRS21531DSTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a thermal interface material (TIM) between the device and the heat sink. Also, follow the recommended operating conditions and derating guidelines.
  • The maximum allowed voltage on the VCC pin is 20V, but it's recommended to operate within the specified range of 12V to 15V for optimal performance and reliability.
  • Use a voltage regulator or a TVS diode to protect the device from overvoltage. Implement overcurrent protection using a fuse or a current-sensing resistor with a comparator or a dedicated overcurrent protection IC.
  • A gate drive circuit with a low impedance output stage, such as a totem pole or a push-pull configuration, is recommended. The circuit should be able to provide a high current (e.g., 1A) and a fast rise time (e.g., 10ns) to ensure proper switching of the power MOSFET.

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IRS21531DSTRPBF Overview

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