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IRS2817DSTRPBF - Infineon

Description: Gate Drivers The factory is currently not accepting orders for this product

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IRS2817DSTRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IRS2817DSTRPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IRS2817DSTRPBF Details

  • Manufacturer Part Number:

    IRS2817DSTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    10 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.7 µs

  • Turn-on Time:

    0.715 µs

  • Width:

    3.9 mm

IRS2817DSTRPBF Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN-1119, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • Infineon provides recommended gate drive circuits in the application note AN-978, which include guidelines for selecting the right gate driver IC, resistors, and capacitors to ensure optimal switching performance and minimize electromagnetic interference (EMI).
  • Infineon provides troubleshooting guidelines in the application note AN-1120, which include steps to identify and resolve common issues like over-temperature shutdown or overcurrent protection, including checking for proper thermal design, component selection, and PCB layout.
  • When handling the IRS2817DSTRPBF, it's essential to follow standard safety precautions for handling electronic components, including wearing anti-static wrist straps, using anti-static mats, and avoiding touching sensitive pins to prevent electrostatic discharge (ESD) damage.

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IRS2817DSTRPBF Overview

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