IS22EF08GP-JCLA2 - Integrated Silicon Solution Inc.

IS22EF08GP-JCLA2 Details

• Manufacturer Part Number:

  IS22EF08GP-JCLA2

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-153

• Country Of Origin:

  Mainland China, Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Integrated Silicon Solution Inc

• YTEOL:

  8

• Clock Frequency-Max (fCLK):

  200 MHz

• JESD-30 Code:

  R-PBGA-B153

• JESD-609 Code:

  e1

• Length:

  13 mm

• Memory Density:

  68719476736 bit

• Memory IC Type:

  eMMC

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  153

• Number of Words:

  8589934592 words

• Number of Words Code:

  8000000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  8GX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA153,14X14,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  3.3 V

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1 mm

• Serial Bus Type:

  EMMC 5.1

• Standby Current-Max:

  0.00005 A

• Supply Current-Max:

  0.075 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Type:

  MLC NAND TYPE

• Width:

  11.5 mm

• Write Protection:

  SOFTWARE