IS25LP512M-RHLA3 - Integrated Silicon Solution Inc.

IS25LP512M-RHLA3 Details

• Manufacturer Part Number:

  IS25LP512M-RHLA3

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-24

• Country Of Origin:

  Mainland China, Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Factory Lead Time:

  12 Weeks

• Date Of Intro:

  2017-07-17

• Manufacturer:

  Integrated Silicon Solution Inc

• YTEOL:

  6.25

• Alternate Memory Width:

  1

• Clock Frequency-Max (fCLK):

  133 MHz

• Data Retention Time-Min:

  20

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PBGA-B24

• JESD-609 Code:

  e1

• Length:

  8 mm

• Memory Density:

  536870912 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  24

• Number of Words:

  67108864 words

• Number of Words Code:

  64000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  64MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA24,5X5,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  3 V

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.2 mm

• Serial Bus Type:

  SPI

• Standby Current-Max:

  0.00026 A

• Supply Current-Max:

  0.035 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.3 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  10

• Type:

  NOR TYPE

• Width:

  6 mm

• Write Protection:

  HARDWARE/SOFTWARE