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IS29GL256-70SLEB - Integrated Silicon Solution Inc.

Description: NOR Flash 256Mb, 56 pin TSOP, 3V, RoHS, Lowest Sector Protected

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IS29GL256-70SLEB - Integrated Silicon Solution Inc. PCB footprint - Small Outline Packages - Small Outline Packages - 56L TSOP-1(14x20)
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IS29GL256-70SLEB - Integrated Silicon Solution Inc.  - 3D model - Small Outline Packages - 56L TSOP-1(14x20)
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IS29GL256-70SLEB Details

  • Manufacturer Part Number:

    IS29GL256-70SLEB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Integrated Silicon Solution Inc

  • YTEOL:

    4.7

  • Access Time-Max:

    70 ns

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    14 mm

IS29GL256-70SLEB Frequently Asked Questions (FAQs)

  • The IS29GL256-70SLEB has a minimum of 100,000 erase cycles, but the actual number of cycles may vary depending on usage and environmental conditions.
  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation. During hold, the device will tri-state its outputs and ignore any input signals.
  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal. This ensures proper device initialization and prevents latch-up conditions.
  • The optimal write buffer size depends on the specific application requirements, such as data transfer rate, latency, and power consumption. A larger buffer size can improve performance but increases power consumption, while a smaller buffer size reduces power consumption but may impact performance.
  • The WP# pin is used to protect the entire memory array or specific sectors from accidental writes. When WP# is asserted low, the device will ignore write commands to the protected areas. De-asserting WP# high allows normal write operations.

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IS29GL256-70SLEB Overview

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