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IS37SML01G1-LLI - Integrated Silicon Solution Inc.

Description: NAND Flash 1G 3.3V 104MHz Serial NAND Flash

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IS37SML01G1-LLI - Integrated Silicon Solution Inc. PCB footprint - Small Outline No-lead - Small Outline No-lead - WSON
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IS37SML01G1-LLI - Integrated Silicon Solution Inc.  - 3D model - Small Outline No-lead - WSON
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IS37SML01G1-LLI Details

  • Manufacturer Part Number:

    IS37SML01G1-LLI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WSON-8

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Integrated Silicon Solution Inc

  • YTEOL:

    6.45

  • Clock Frequency-Max (fCLK):

    104 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWSON

  • Package Equivalence Code:

    SOLCC8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE

IS37SML01G1-LLI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 0.1uF decoupling capacitor between VCC and GND near the chip.
  • Use a clock frequency of 20MHz or less, ensure the slave select line is properly driven, and use a pull-up resistor on the MISO line. Also, ensure the master and slave devices are properly synchronized.
  • The IS37SML01G1-LLI is rated for operation from -40°C to 85°C. However, it's recommended to operate within -20°C to 70°C for optimal performance and reliability.
  • Yes, the IS37SML01G1-LLI has a low power consumption of 1.8V to 3.6V, making it suitable for battery-powered applications. However, ensure proper power management and voltage regulation to minimize power consumption.
  • Implement error detection and correction mechanisms, such as CRC checks and retry mechanisms, to handle errors during data transfer. Also, ensure proper handling of exceptions, such as timeouts and bus errors.

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