ISD2560P - Winbond

ISD2560P Details

• Manufacturer Part Number:

  ISD2560P

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  DIP

• Package Description:

  0.600 INCH, PLASTIC, DIP-28

• Pin Count:

  28

• HTS Code:

  8542.39.00.60

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  0

• Application:

  CAR STEREO; HANDSET; TRANSFORMER

• Consumer IC Type:

  SPEECH SYNTHESIZER WITH RCDG

• JESD-30 Code:

  R-PDIP-T28

• JESD-609 Code:

  e0

• Length:

  36.83 mm

• Number of Functions:

  1

• Number of Terminals:

  28

• On Chip Memory Type:

  EEPROM

• Operating Temperature-Max:

  70 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP28,.6

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Qualification Status:

  Not Qualified

• Reading Time-Max:

  60 s

• Seated Height-Max:

  4.83 mm

• Supply Current-Max:

  30 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  4.5 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Width:

  15.24 mm