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ISD4004-08MSI - Winbond

Description: Pad Opening (min) 90 x 90 m

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PCB Footprints
ISD4004-08MSI - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
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3D Models
ISD4004-08MSI - Winbond  - 3D model - Small Outline Packages - 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
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ISD4004-08MSI Details

  • Manufacturer Part Number:

    ISD4004-08MSI

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.300 INCH, PLASTIC, SOIC-28

  • Pin Count:

    28

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Application:

    HAND-HELD DEVICES

  • Consumer IC Type:

    SPEECH SYNTHESIZER WITH RCDG

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e0

  • Length:

    17.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • On Chip Memory Type:

    ROM

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Reading Time-Max:

    480 s

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max (Vsup):

    3.3 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

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ISD4004-08MSI Overview

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