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ISL12057IBZ-T - Renesas Electronics

Description: The ISL12057 device is a low-power, real-time clock that is pin compatible and functionally equivalent to Maxim DS1337 with clock/calendar and alarm function. The oscillator uses an external, low-cost 32. 768kHz crystal with 6pF load capacitance. The real-time clock tracks time with separate registers for hours, minutes, and seconds. The device has calendar registers for date, month, year, and day of the week. The calendar is accurate through 2099, with automatic leap year correction.

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ISL12057IBZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 Ld SOIC
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ISL12057IBZ-T - Renesas Electronics  - 3D model - Small Outline Packages - 8 Ld SOIC
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ISL12057IBZ-T Details

  • Manufacturer Part Number:

    ISL12057IBZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Clock Frequency-Max:

    0.032 MHz

  • Information Access Method:

    SERIAL(I2C)

  • Interrupt Capability:

    Y

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time-Min:

    SECONDS

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Volatile:

    NO

  • Width:

    3.9 mm

  • uPs/uCs/Peripheral ICs Type:

    TIMER, REAL TIME CLOCK

ISL12057IBZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL12057IBZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the crystal oscillator to minimize noise. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the accuracy of the clock output from the ISL12057IBZ-T, it's essential to use a high-quality crystal oscillator with a low equivalent series resistance (ESR) and a high-quality capacitor with a low equivalent series inductance (ESL). Additionally, the PCB layout should be designed to minimize noise and ensure a stable power supply.
  • The maximum frequency deviation of the ISL12057IBZ-T is ±20 ppm over the operating temperature range. This deviation can affect the system design, particularly in applications requiring high-frequency accuracy. To mitigate this, designers can use a more accurate external clock source or implement a clock correction mechanism in their system.
  • The ISL12057IBZ-T has a built-in POR and BOR function to ensure a reliable startup and operation. To handle these functions, designers should ensure a stable power supply, use a capacitor to filter the power supply voltage, and implement a reset circuit to handle the POR and BOR signals.
  • The ISL12057IBZ-T has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, designers should consider the thermal resistance of the package, use a heat sink if necessary, and ensure good airflow around the device. Additionally, designers should follow the recommended PCB layout and thermal design guidelines to minimize thermal resistance.

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ISL12057IBZ-T Overview

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