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ISL28210FBZ-T7 - Renesas Electronics

Description: The ISL28210 are dual JFET amplifiers featuring low noise, high slew rate, low input bias current, and offset voltage, making them the ideal choice for high impedance applications where precision and low noise are important. The combination of precision, low noise, and high speed combined with a small footprint provides the user with outstanding value and flexibility relative to similar competitive parts. Applications for these amplifiers include precision medical and analytical instrumentation, sensor cond

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ISL28210FBZ-T7 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15E
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ISL28210FBZ-T7 - Renesas Electronics  - 3D model - Small Outline Packages - M8.15E
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ISL28210FBZ-T7 Details

  • Manufacturer Part Number:

    ISL28210FBZ-T7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000245 µA

  • Bias Current-Max (IIB) @25C:

    0.000002 µA

  • Common-mode Reject Ratio-Min:

    88 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1300 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -21 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    7.6 mA

  • Supply Voltage Limit-Max:

    21 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    12500

  • Voltage Gain-Min:

    141253.75

  • Wideband:

    NO

  • Width:

    3.9 mm

ISL28210FBZ-T7 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The application note AN1995 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28210FBZ-T7 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28210FBZ-T7 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure EMC, Renesas recommends following proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as necessary. Additionally, the application note AN1995 provides guidance on EMC considerations for the ISL28210FBZ-T7.

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