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ISL28214FBZ-T13 - Renesas Electronics

Description: The ISL28214 is a dual general purpose micropower, rail-to-rail input and output (RRIO) operational amplifier with a supply voltage range of 1.8V to 5.5V. Key features are a low supply current of 390μA maximum per channel at room temperature, a low bias current, and a wide input voltage range, which enables the ISL28214 device to be an excellent general purpose op amp for a wide range of applications. The ISL28214 is available in the MSOP8, SO8 and SOT23-8 packages. And, the device operate across the extend

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ISL28214FBZ-T13 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 Ld SOIC -
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ISL28214FBZ-T13 Details

  • Manufacturer Part Number:

    ISL28214FBZ-T13

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00003 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    0.95 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5000

  • Wideband:

    NO

  • Width:

    3.9 mm

ISL28214FBZ-T13 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The datasheet provides more information on capacitor selection and layout considerations.
  • The maximum power dissipation of the ISL28214FBZ-T13 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28214FBZ-T13 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the device in high-temperature environments.
  • Renesas provides guidelines for EMC in their application note AN1995, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with EMC standards.

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