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ISL28218FBZ-T13 - Renesas Electronics

Description: The ISL28118, ISL28218 are single and dual, low-power precision amplifiers optimized for single-supply applications. These devices feature a common mode input voltage range extending to 0.5V below the V- rail, a rail-to-rail differential input voltage range for use as a comparator and rail-to-rail output voltage swing, which makes them ideal for single-supply applications where input operation at ground is important. These op amps feature low power, low offset voltage and low temperature drift, making them

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ISL28218FBZ-T13 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8. 15E SOIC
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ISL28218FBZ-T13 Details

  • Manufacturer Part Number:

    ISL28218FBZ-T13

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-11-07

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    97 dB

  • Common-mode Reject Ratio-Nom:

    117 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    290 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -21 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    2.8 mA

  • Supply Voltage Limit-Max:

    21 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3200

  • Voltage Gain-Min:

    63554.98291

  • Wideband:

    NO

  • Width:

    3.9 mm

ISL28218FBZ-T13 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The application note AN1995 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28218FBZ-T13 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28218FBZ-T13 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure EMC, Renesas recommends following proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as necessary. Additionally, the application note AN1995 provides guidance on EMC considerations for the ISL28218FBZ-T13.

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ISL28218FBZ-T13 Overview

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