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ISL28233FUZ - Renesas Electronics

Description: The ISL28233 is a dual micropower, chopper stabilized operational amplifier that is optimized for single and dual supply operation from 1.65V to 6.0V and ±0.825V to ±3.0V. Its low supply current of 18µA and wide input range enable the ISL28233 to be an excellent general purpose op amp for a wide range of applications. This op amp is ideal for handheld devices that operate off 2 AA or single Li-ion batteries. The ISL28233 is available in 8 Ld MSOP, 8 Ld SOIC and 8 Ld DFN packages and operates over the temper

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ISL28233FUZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.118A MSOP
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ISL28233FUZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.118A MSOP
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ISL28233FUZ Details

  • Manufacturer Part Number:

    ISL28233FUZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.118A

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.18 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    125 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    11 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    400

  • Wideband:

    NO

  • Width:

    3 mm

ISL28233FUZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in the application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The application note AN1995 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28233FUZ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28233FUZ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the device in high-temperature environments.
  • Renesas provides guidelines for EMC design in the application note AN1995, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure EMC compliance.

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