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ISL28408FBZ - Renesas Electronics

Description: The ISL28108, ISL28208 and ISL28408 are single, dual and quad low power precision amplifiers optimized for single supply applications. These devices feature a common mode input voltage range extending to 0. 5V below the V- rail, a rail-to-rail differential input voltage range for use as a comparator, and rail-to-rail output voltage swing, which make them ideal for single supply applications where input operation at ground is important. Added features include low offset voltage, and low temperature drift mak

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ISL28408FBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M14.15-
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ISL28408FBZ Details

  • Manufacturer Part Number:

    ISL28408FBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    97 dB

  • Common-mode Reject Ratio-Nom:

    112 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    330 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.7 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -21 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    21 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    89125

  • Wideband:

    NO

  • Width:

    3.9 mm

ISL28408FBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL28408FBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The ISL28408FBZ requires a single 5V power supply. It's recommended to power the device with a clean, low-noise power supply, and to ensure that the power supply is stable before applying signals to the device. The power sequencing requirements are not critical, but it's recommended to power the device after the power supply has stabilized.
  • The recommended input impedance for the ISL28408FBZ is 1kΩ to 10kΩ, and the recommended output impedance is 1kΩ to 100kΩ. However, the optimal impedance values may vary depending on the specific application and signal frequencies.
  • The ISL28408FBZ has built-in ESD protection, but it's still recommended to take precautions to prevent ESD damage during handling and assembly. This includes using ESD-safe handling procedures, using ESD-protective packaging, and ensuring that the device is properly grounded during assembly.
  • The ISL28408FBZ has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. Additionally, it's recommended to use thermal vias to connect the thermal plane to the ground plane, and to use a heat sink or thermal interface material if necessary.

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ISL28408FBZ Overview

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