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ISL28413FVZ - Renesas Electronics

Description: The ISL28113, ISL28213 and ISL28413 are single, dual and quad channel general purpose micropower, rail-to-rail input and output operational amplifiers with supply voltage range of 1. 8V to 5. 5V. Key features are a low supply current of 130µA maximum per channel at room temperature, a low bias current and a wide input voltage range, which enables the ISL28x13 devices to be excellent general purpose operational amplifiers for a wide range of applications. The ISL28113 is available in the SC70-5 and SOT23-5 p

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ISL28413FVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - MDP0044
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ISL28413FVZ Details

  • Manufacturer Part Number:

    ISL28413FVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    MDP0044

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-11-07

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.00003 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.68 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Wideband:

    NO

  • Width:

    4.4 mm

ISL28413FVZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1965, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 1-10uF for input and output decoupling. The application note AN1965 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28413FVZ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation at a specific temperature.
  • The ISL28413FVZ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure EMC, it's recommended to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Renesas also provides guidance on EMC in their application note AN1965.

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