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ISL43112IHZ-T - Renesas Electronics

Description: The Intersil ISL43112 and ISL43113 are precision, high performance analog switches designed to operate from ±1. 5V to ±6V supplies. These devices are fully specified for 10% tolerance ±5V and ±3. 3V supplies and feature supply and leakage currents much lower than those of other single SPST switches. Turn-on and turn-off times are also improved. Targeted applications include battery powered equipment that benefit from the devices’ low power consumption (250μW), sub-nanoamp leakage currents and fast switching

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ISL43112IHZ-T - Renesas Electronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - P5.064
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ISL43112IHZ-T - Renesas Electronics  - 3D model - SOT23 (5-Pin) - P5.064
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ISL43112IHZ-T Details

  • Manufacturer Part Number:

    ISL43112IHZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    P5.064

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -1.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -3.3 V

  • Normal Position:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance-Max (Ron):

    40 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.05 mA

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    75 ns

  • Switch-on Time-Max:

    110 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

ISL43112IHZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL43112IHZ-T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate analog ground plane and to keep the analog and digital grounds separate.
  • To ensure stability, it's essential to follow the recommended capacitor values and types, and to ensure that the output capacitor has a low equivalent series resistance (ESR). Additionally, the input voltage should be well-regulated, and the device should be operated within its recommended operating conditions.
  • The maximum allowed input voltage ripple for the ISL43112IHZ-T is 10% of the input voltage. Exceeding this limit may affect the device's performance and stability.
  • The ISL43112IHZ-T is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's essential to consider the device's thermal characteristics and to ensure proper heat dissipation in high-temperature applications.
  • To troubleshoot issues with the ISL43112IHZ-T, start by verifying the input voltage and current, and checking the output voltage and current. Use an oscilloscope to check for oscillations or noise on the output. Also, ensure that the device is properly soldered and that the PCB layout is correct.

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