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ISL55210IRTZ-T7A - Renesas Electronics

Description: The ISL55210 is a very wide band, fully differential amplifier (FDA) intended for high dynamic range ADC input interface applications. This voltage feedback FDA design includes an independent output common mode voltage control. At the lowest quiescent power (115mW), the ISL55210 offers a 4.0GHz gain bandwidth product with a very low input noise of 0.85nV/√(Hz). In a balanced differential I/O configuration, with 2VP-P output into a 200Ω load configured for a gain of 15dB, the IM3 terms are <-100dBc through 1

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ISL55210IRTZ-T7A - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L16.3x3D
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ISL55210IRTZ-T7A - Renesas Electronics  - 3D model - Quad Flat No-Lead - L16.3x3D
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ISL55210IRTZ-T7A Details

  • Manufacturer Part Number:

    ISL55210IRTZ-T7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    L16.3X3D

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    140 µA

  • Bandwidth (3dB)-Nom:

    30 MHz

  • Bias Current-Max (IIB) @25C:

    120 µA

  • Common-mode Reject Ratio-Min:

    56 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    5 µA

  • Input Offset Voltage-Max:

    1600 µV

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    150 V/us

  • Supply Current-Max:

    39.5 mA

  • Supply Voltage Limit-Max:

    4.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4000000

  • Voltage Gain-Min:

    19952.62315

  • Wideband:

    YES

  • Width:

    3 mm

ISL55210IRTZ-T7A Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL55210 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is operated within the recommended temperature range. Additionally, a minimum ESR of 10mΩ is recommended for the output capacitor.
  • The ISL55210 can handle a maximum input voltage of 6.5V. Exceeding this voltage may damage the device.
  • The ISL55210 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's performance and consider thermal management techniques in high-temperature applications.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, decoupling, and thermal management. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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