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ISL5585DIMZ - Renesas Electronics

Description: The 3.3V family of Ringing Subscriber Line Interface Circuits (RSLICs) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline voice over broadband applications. Ideally suited for customer premise equipment, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. The ISL5585 family is capable of operating with 100V ringing battery supply, which translates directly to the amount of ring

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ISL5585DIMZ - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - N28.45
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ISL5585DIMZ Details

  • Manufacturer Part Number:

    ISL5585DIMZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PLCC

  • Pin Count:

    28

  • Manufacturer Package Code:

    N28.45

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-09-26

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Battery Feed:

    CONSTANT CURRENT/RESISTIVE

  • Battery Supply:

    -85 V

  • Hybrid:

    2-4 CONVERSION

  • JESD-30 Code:

    S-PQCC-J28

  • JESD-609 Code:

    e3

  • Length:

    11.505 mm

  • Moisture Sensitivity Level:

    3

  • Noise-Max:

    13 dBrnC

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC28,.45SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    4.57 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    SLIC

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.505 mm

ISL5585DIMZ Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the ISL5585DIMZ. Renesas recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital grounds separate. Additionally, place the device close to the power supply and use short, wide traces for the power lines. A good layout will help minimize noise and ensure stable operation.
  • The ISL5585DIMZ has a thermal pad on the bottom of the package, which is connected to the die. To ensure proper thermal management, Renesas recommends connecting the thermal pad to a solid ground plane on the PCB, and using thermal vias to dissipate heat. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close as possible to the VIN pin and the GND pin. A low-ESR capacitor will help reduce voltage ripple and ensure stable operation.
  • To ensure proper power-up and power-down sequencing, Renesas recommends using an external power-on reset (POR) circuit to monitor the input voltage and generate a reset signal when the voltage is below a certain threshold. Additionally, use a soft-start circuit to slowly ramp up the output voltage during power-up.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the output capacitor. The capacitor should be placed as close as possible to the VOUT pin and the GND pin. A low-ESR capacitor will help reduce voltage ripple and ensure stable operation.

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ISL5585DIMZ Overview

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