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ISL6218CVZ-T - Renesas Electronics

Description: The ISL6218 Single-Phase Buck PWM control IC, with integrated half bridge gate driver, provides a precision voltage regulation system for advanced Pentium-M microprocessors in notebook computers. This control IC also features both input voltage feed-forward and average current mode control for excellent dynamic response, Loss-less current sensing using MOSFET rDS(ON), and user selectable switching frequencies from 250kHz to 500kHz per phase. The ISL6218 includes a 6-bit digital-to-analog converter (DAC) tha

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ISL6218CVZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M38.173
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ISL6218CVZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M38.173
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ISL6218CVZ-T Details

  • Manufacturer Part Number:

    ISL6218CVZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    M38.173

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    500 kHz

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL6218CVZ-T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the thermal path short and using a thermal pad on the top layer can help to improve thermal performance.
  • To ensure reliable start-up and shutdown of the device, it is recommended to follow the power-up and power-down sequencing guidelines outlined in the datasheet. This includes ensuring that the input voltage is stable and within the recommended range before enabling the device, and disabling the device before removing power.
  • Operating the device outside of the recommended operating conditions can lead to reduced performance, decreased reliability, and potentially even damage to the device. It is recommended to operate the device within the specified temperature range, input voltage range, and output current range to ensure optimal performance and reliability.
  • To troubleshoot issues with the device, it is recommended to follow a systematic approach, starting with checking the input voltage, output voltage, and output current. Verify that the device is operating within the recommended operating conditions, and check for any signs of overheating or electrical overstress. If the issue persists, consult the datasheet and application notes for guidance, or contact Renesas technical support for further assistance.
  • The ISL6218CVZ-T is designed to meet EMI and EMC requirements, but it is still important to follow good design practices to minimize electromagnetic interference. This includes using a solid ground plane, keeping signal traces short and away from noise sources, and using shielding and filtering as necessary. Additionally, ensure that the device is operated within the recommended frequency range and that the output voltage is properly decoupled.

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