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ISL6261AIRZ - Renesas Electronics

Description: The ISL6261A is a single-phase buck regulator implementing lntel® IMVP-6® protocol, with embedded gate drivers. lntel® Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology effectively reducing power dissipation in lntel® Pentium processors. The heart of the ISL6261A is the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with the traditional multi-phase buck regulator, the R3 Technology™ has faster transient response. This is due to the R3 modulator comma

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PCB Footprints
ISL6261AIRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L40.6x6
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ISL6261AIRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L40.6x6
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ISL6261AIRZ Details

  • Manufacturer Part Number:

    ISL6261AIRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.6X6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    21 V

  • Input Voltage-Min:

    5 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    1.5 V

  • Output Voltage-Min:

    0.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    3.6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    500 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

ISL6261AIRZ Frequently Asked Questions (FAQs)

  • The recommended layout for the ISL6261AIRZ involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-current paths short and wide. Additionally, it is recommended to place the output capacitors close to the VOUT pin and to use a separate ground plane for the output stage.
  • To select the right inductor for the ISL6261AIRZ, consider the following factors: inductance value, current rating, and DC resistance. The inductance value should be chosen based on the desired switching frequency and output voltage. The current rating should be higher than the maximum output current, and the DC resistance should be as low as possible to minimize losses.
  • The maximum junction temperature for the ISL6261AIRZ is 150°C. It is recommended to keep the junction temperature below 125°C for optimal performance and reliability.
  • To troubleshoot issues with the ISL6261AIRZ, start by checking the input and output voltages, and the current drawn from the input source. Verify that the component values and layout meet the recommended specifications. Use an oscilloscope to check for oscillations or ringing on the output voltage and current waveforms. Check for any signs of overheating, such as excessive temperature rise or thermal shutdown.
  • The ISL6261AIRZ is rated for operation up to 105°C ambient temperature. However, it is recommended to derate the output current and voltage according to the temperature derating curve provided in the datasheet. Additionally, ensure that the device is properly heatsinked and that the thermal design is adequate for the specific application.

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ISL6261AIRZ Overview

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