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ISL62771IRTZ - Renesas Electronics

Description: The ISL62771 is fully compliant with AMD Fusion SVI 2. 0 and provides a complete solution for microprocessor and graphics processor core power. The ISL62771 controller supports two Voltage Regulators (VRs) with three integrated gate drivers. The Core VR supports 2-, or 1-phase configurations while the Northbridge VR supports 1-phase operation. The two VRs share a serial control bus to communicate with the AMD CPU and achieve lower cost and smaller board area compared with two-chip solutions. The PWM modulat

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PCB Footprints
ISL62771IRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L40.5x5+
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3D Models
ISL62771IRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L40.5x5+
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ISL62771IRTZ Details

  • Manufacturer Part Number:

    ISL62771IRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.5X5

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-27

  • Manufacturer:

    Renesas Electronics Corporation

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    11 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    400 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL62771IRTZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The IC should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the input voltage is within the recommended range, and that the device is properly decoupled with capacitors. Also, follow the recommended PCB layout and thermal design guidelines.
  • The maximum allowed capacitance for the output capacitors is 220uF. Exceeding this value may cause instability or oscillations.
  • Check the input voltage, output voltage, and enable pin voltage. Verify that the device is properly configured and that the input and output capacitors are properly sized and connected.
  • Yes, the ISL62771IRTZ is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.

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ISL62771IRTZ Overview

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