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ISL6312AIRZ - Renesas Electronics

Description: The ISL6312A four-phase PWM control IC provides a precision voltage regulation system for advanced microprocessors. The integration of power MOSFET drivers into the controller IC marks a departure from the separate PWM controller and driver configuration of previous multiphase product families. By reducing the number of external parts, this integration is optimized for a cost and space saving power management solution. One outstanding feature of this controller IC is its multi-processor compatibility, allow

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ISL6312AIRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L48.7x7 QFN-1
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ISL6312AIRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L48.7x7 QFN-1
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ISL6312AIRZ Details

  • Manufacturer Part Number:

    ISL6312AIRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    L48.7X7

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT VOLTAGE RANGE IS 1.5V TO 3.9V

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

ISL6312AIRZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance can be found in the ISL6312AIRZ evaluation board user manual or by contacting Renesas Electronics Corporation's technical support. A good layout should minimize noise, ensure proper thermal dissipation, and follow the datasheet's guidelines for component placement and routing.
  • The selection of external components such as inductors, capacitors, and resistors depends on the specific application requirements. Renesas Electronics Corporation provides a component selection guide in the datasheet or application notes. Additionally, online tools and simulation software can be used to aid in component selection.
  • The ISL6312AIRZ has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. The datasheet provides thermal resistance and junction-to-case thermal resistance values. A thermal analysis should be performed to ensure the device operates within its recommended temperature range.
  • Troubleshooting issues with the ISL6312AIRZ involves identifying the symptoms, checking the PCB layout and component values, and verifying the input and output voltages and currents. Renesas Electronics Corporation provides troubleshooting guides and application notes that can aid in the debugging process.
  • The ISL6312AIRZ is designed to meet EMI and EMC standards, but proper PCB layout, component selection, and shielding are still necessary to ensure compliance. Renesas Electronics Corporation provides EMI and EMC guidelines in the datasheet and application notes.

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ISL6312AIRZ Overview

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