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ISL6353CRTZ - Renesas Electronics

Description: The ISL6353 is a three-phase PWM buck regulator controller for VR12 DDR memory applications. The multi-phase implementation results in better system performance, superior thermal management, lower component cost and smaller PCB area. The ISL6353 has two integrated power MOSFET drivers for implementing a cost effective and space saving power management solution. The PWM modulator of the ISL6353 is based on Renesas' Robust Ripple Regulator™ (R3) technology. Compared with the traditional multi-phase buck regul

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PCB Footprints
ISL6353CRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L40.5x5
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ISL6353CRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L40.5x5
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ISL6353CRTZ Details

  • Manufacturer Part Number:

    ISL6353CRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.5X5

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-27

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    4.6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    300 kHz

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL6353CRTZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the high-current paths. Avoid routing sensitive analog signals near the high-current paths.
  • Use a thermal interface material (TIM) between the IC and the heat sink. Ensure good airflow around the heat sink, and consider using a fan or heat sink with a high thermal conductivity. Monitor the junction temperature (TJ) and adjust the heat sink design accordingly.
  • Choose capacitors with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum input voltage. Ensure the capacitors are placed close to the IC and connected with short, wide traces. X5R or X7R ceramic capacitors are good options.
  • Use an oscilloscope to monitor the input and output voltages, as well as the current sense signals. Check for proper PCB layout, component selection, and thermal management. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • The current limit and foldback current limit protect the IC from overcurrent conditions. Ensure that the system design takes into account these limits to prevent damage to the IC or other components. Consider using overcurrent protection devices or fuses to complement the IC's built-in protection.

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ISL6353CRTZ Overview

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