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ISL6353IRTZ - Renesas Electronics

Description: The ISL6353 is a three-phase PWM buck regulator controller for VR12 DDR memory applications. The multi-phase implementation results in better system performance, superior thermal management, lower component cost and smaller PCB area. The ISL6353 has two integrated power MOSFET drivers for implementing a cost effective and space saving power management solution. The PWM modulator of the ISL6353 is based on Renesas' Robust Ripple Regulator™ (R3) technology. Compared with the traditional multi-phase buck regul

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ISL6353IRTZ - Renesas Electronics - PCB symbol
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PCB Footprints
ISL6353IRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L40.5x5
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3D Models
ISL6353IRTZ - Renesas Electronics - 3D model - Quad Flat No-Lead - L40.5x5
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ISL6353IRTZ Details

  • Manufacturer Part Number:

    ISL6353IRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.5X5

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-27

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    4.6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    300 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL6353IRTZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the high-current paths. Avoid routing sensitive signals near the switching nodes.
  • Use the datasheet's recommended compensation network values as a starting point. Then, adjust the values based on the specific application's requirements and the desired transient response. Use simulation tools or empirical methods to fine-tune the compensation network for optimal stability and performance.
  • Ensure good thermal conduction by using a thermal pad or a heat sink. Keep the IC away from heat sources and ensure good airflow. Use thermal interface materials to reduce thermal resistance. Monitor the junction temperature and adjust the design accordingly to prevent overheating.
  • Use a TVS diode or a voltage clamp to protect the input from voltage surges. Add a fuse or a PTC thermistor to prevent overcurrent conditions. Implement overvoltage protection using a voltage monitor or a supervisor IC to detect and respond to overvoltage conditions.
  • Choose capacitors with low ESR and high ripple current ratings. Ensure the capacitors can handle the maximum input voltage and output current. Consider the capacitor's temperature rating, and select capacitors with a high temperature rating to ensure reliable operation.

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ISL6353IRTZ Overview

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