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ISL81802FVEZ-T7A - Renesas Electronics

Description: The ISL81802 is a dual synchronous buck controller that generates two independent outputs or one output with two interleaved phases for a wide variety of applications in industrial and general purpose segments. With a wide input and output voltage ranges, the controller is suitable for telecommunication, data center, and computing applications.The ISL81802 uses peak current mode control with phase interleaving for the two outputs. Each output has a voltage regulator, current monitor, and average current reg

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ISL81802FVEZ-T7A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M38.173C
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ISL81802FVEZ-T7A - Renesas Electronics  - 3D model - Small Outline Packages - M38.173C
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ISL81802FVEZ-T7A Details

  • Manufacturer Part Number:

    ISL81802FVEZ-T7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-EP

  • Pin Count:

    38

  • Manufacturer Package Code:

    M38.173C

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-10-15

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    80 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    8 V

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    76 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    7 mA

  • Supply Voltage-Nom (Vsup):

    8 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL81802FVEZ-T7A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device's power pins.
  • Follow the power-up sequence: VCC, then VDD, then EN (enable) pin. Ensure the input voltage is within the recommended range (1.7V to 5.5V). Configure the device using the SPI interface, following the datasheet's configuration register settings.
  • The device has a thermal pad on the bottom. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape or thermal grease) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • Use a logic analyzer or oscilloscope to monitor the SPI interface and verify the configuration registers. Check the power supply and decoupling capacitors. Verify the PCB layout and thermal design. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, follow good EMI/EMC design practices: use a shielded enclosure, keep the device away from antennas and high-frequency sources, and use EMI filters or shielding on the PCB. Ensure the PCB layout minimizes radiation and susceptibility.

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ISL81802FVEZ-T7A Overview

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