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ISL8200AMMRZ - Renesas Electronics

Description: The ISL8200AM is a simple and easy to use high power, current-sharing DC/DC power module for datacom, telecom, and FPGA power hungry applications. All that is needed is the ISL8200AM, a few passive components, and one VOUT setting resistor to have a complete 10A design ready for market. The ease of use practically eliminates design and manufacturing risks while dramatically improving time to market. Parallel up to six ISL8200AM modules to scale up to a 60A solution for more output current. The simplicity of

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ISL8200AMMRZ - Renesas Electronics PCB footprint - Other - Other - ISL8200AMMRZ-3
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ISL8200AMMRZ - Renesas Electronics  - 3D model - Other - ISL8200AMMRZ-3
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ISL8200AMMRZ Details

  • Manufacturer Part Number:

    ISL8200AMMRZ

  • Brand Name:

    Renesas

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    Module

  • Package Description:

    QFN-23

  • Pin Count:

    23

  • Manufacturer Package Code:

    L23.15X15

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2017-12-21

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 6V

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    4.5 V

  • JESD-30 Code:

    S-PQCC-N23

  • JESD-609 Code:

    e3

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    23

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Output Voltage-Max:

    6 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC23,.62SQ,43

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Seated Height-Max:

    2.4 mm

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    700 kHz

  • Technology:

    MOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.1 mm

  • Terminal Position:

    QUAD

  • Width:

    15 mm

ISL8200AMMRZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias connecting the exposed pad to the ground plane is recommended for optimal thermal performance.
  • Ensure that the input voltage rises monotonically and does not droop during start-up. A soft-start circuit can be used to control the input voltage rise time.
  • The maximum allowed capacitance on the output is 100uF. Exceeding this value may cause instability or oscillations.
  • Yes, the device is rated for operation up to 125°C. However, the maximum junction temperature (TJ) should not exceed 150°C.
  • Check the PCB layout, component selection, and input/output capacitance. Ensure that the device is properly decoupled and that the output is not overloaded.

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ISL8200AMMRZ Overview

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