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ISL84467IVZ-T - Renesas Electronics

Description: The Intersil ISL84467 device is a low ON-resistance, low voltage, bidirectional, Quad SPDT (Dual DPDT) analog switch designed to operate from a single +1. 65V to +4. 5V supply. Targeted applications include battery powered equipment that benefit from low rON (0. 39Ω) and fast switching speeds (tON = 33ns, tOFF = 16ns). The digital logic input is 1. 8V logic-compatible when using a single +3V supply. With a supply voltage of 4. 2V and logic high voltage of 2. 85V at both logic inputs, the part draws only 12µ

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ISL84467IVZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
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ISL84467IVZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
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ISL84467IVZ-T Details

  • Manufacturer Part Number:

    ISL84467IVZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • On-state Resistance-Max (Ron):

    0.95 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.013 mA

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL84467IVZ-T Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the ISL84467EV1Z evaluation board user manual, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • The ISL84467IVZ-T has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane. Additionally, ensure good airflow around the device and avoid blocking the airflow with nearby components.
  • The recommended input capacitor value is 1uF to 10uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 25V. A ceramic capacitor such as X5R or X7R is recommended due to its low ESR and high reliability.
  • The ISL84467IVZ-T has a power-on reset (POR) circuit that ensures the device is properly powered up and configured during startup. The POR circuit monitors the input voltage and ensures that the device is reset until the input voltage reaches a minimum threshold. Additionally, the device has a soft-start feature that gradually ramps up the output voltage to prevent inrush currents.
  • The ISL84467IVZ-T has a maximum output current capability of 4A per channel, with a total maximum output current of 8A for both channels. However, the actual output current capability may be limited by the thermal performance of the device and the PCB design.

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