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ISL84467IVZ - Renesas Electronics

Description: The Intersil ISL84467 device is a low ON-resistance, low voltage, bidirectional, Quad SPDT (Dual DPDT) analog switch designed to operate from a single +1. 65V to +4. 5V supply. Targeted applications include battery powered equipment that benefit from low rON (0. 39Ω) and fast switching speeds (tON = 33ns, tOFF = 16ns). The digital logic input is 1. 8V logic-compatible when using a single +3V supply. With a supply voltage of 4. 2V and logic high voltage of 2. 85V at both logic inputs, the part draws only 12µ

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ISL84467IVZ - Renesas Electronics - PCB symbol
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PCB Footprints
ISL84467IVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.173A
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ISL84467IVZ - Renesas Electronics - 3D model - Small Outline Packages - M16.173A
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ISL84467IVZ Details

  • Manufacturer Part Number:

    ISL84467IVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • On-state Resistance-Max (Ron):

    0.95 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.013 mA

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL84467IVZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the ISL84467EVKIT1Z evaluation kit documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • The ISL84467IVZ has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, the device's thermal shutdown feature can be enabled to prevent overheating.
  • The recommended input capacitor value is 1uF to 10uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 25V. X5R or X7R ceramic capacitors are suitable options. The input capacitor should be placed as close to the VIN pin as possible.
  • Renesas provides a range of application notes and design guides that provide configuration examples for specific applications, such as USB-C power delivery, battery charging, and power backup. These resources can be found on the Renesas website.
  • The ISL84467IVZ has a power-up sequence that ensures the output voltage is stable before enabling the output. During power-down, the device enters a low-power shutdown mode to minimize power consumption. The power-up and power-down sequences can be controlled using the EN pin.

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ISL84467IVZ Overview

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