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ISL88550AIRZ-T - Renesas Electronics

Description: ISL88550A integrates a synchronous buck PWM controller to generate VDDQ, a sourcing and sinking LDO linear regulator to generate VTT, and a 10mA reference output buffer to generate VTTR. The buck controller drives two external N-Channel MOSFETs to generate output voltages down to 0. 7V from a 2V to 25V input with output currents up to 15A. The LDO can source up to 2. 5A and sink up to -2. 0A continuously. Both the LDO output and the 10mA reference buffer output can be made to track the REFIN voltage via a b

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ISL88550AIRZ-T - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L28.5x5B
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ISL88550AIRZ-T - Renesas Electronics  - 3D model - Quad Flat No-Lead - L28.5x5B
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ISL88550AIRZ-T Details

  • Manufacturer Part Number:

    ISL88550AIRZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    L28.5X5B

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-24

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO WORKS IN PFM MODE; OUTPUT VOLTAGE FROM 0.7 TO 3.5 V

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    2 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Current-Max (Isup):

    1 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    600 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL88550AIRZ-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Use a shielded enclosure, keep the device away from antennas and other EMI-sensitive components, and ensure that the PCB layout minimizes radiation. Also, consider using EMI filters and shielding on the input and output lines.
  • Check the voltage and current levels, ensure that the input voltage is within the recommended range, and verify that the device is properly configured. Also, check for any short circuits or overcurrent conditions that may be causing the power-good output to malfunction.
  • Use a high-impedance probe to measure voltage and current, and ensure that the measurement equipment is properly calibrated. Also, use a thermal camera or thermocouple to measure the device temperature, and verify that the device is operating within the recommended specifications.

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ISL88550AIRZ-T Overview

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