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ISL88550AIRZ - Renesas Electronics

Description: ISL88550A integrates a synchronous buck PWM controller to generate VDDQ, a sourcing and sinking LDO linear regulator to generate VTT, and a 10mA reference output buffer to generate VTTR. The buck controller drives two external N-Channel MOSFETs to generate output voltages down to 0. 7V from a 2V to 25V input with output currents up to 15A. The LDO can source up to 2. 5A and sink up to -2. 0A continuously. Both the LDO output and the 10mA reference buffer output can be made to track the REFIN voltage via a b

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ISL88550AIRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L28.5x5B
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ISL88550AIRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L28.5x5B
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ISL88550AIRZ Details

  • Manufacturer Part Number:

    ISL88550AIRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    L28.5X5B

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-24

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO WORKS IN PFM MODE; OUTPUT VOLTAGE FROM 0.7 TO 3.5 V

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    2 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Current-Max (Isup):

    1 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    600 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ISL88550AIRZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Monitor the input voltage, output voltage, and output current to ensure they are within the specified ranges. Also, ensure the device is operated within the recommended temperature range.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7uF to 10uF is recommended for the input capacitor.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke to reduce EMI. Also, ensure good PCB layout practices, such as keeping the power traces short and away from sensitive nodes.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended for the output capacitor.

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ISL88550AIRZ Overview

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