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ISL89163FBEBZ - Renesas Electronics

Description: The ISL89163, ISL89164, and ISL89165 are high-speed, 6A, dual channel MOSFET drivers with enable inputs. Precision thresholds on all logic inputs allow the use of external RC circuits to generate accurate and stable time delays on both the main channel inputs, INA and INB, and the enable inputs, ENA and ENB. The precision delays capable of these precise logic thresholds makes these parts very useful for dead-time control and synchronous rectifiers. Note that the enable and input logic inputs can be intercha

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ISL89163FBEBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15D-1
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ISL89163FBEBZ Details

  • Manufacturer Part Number:

    ISL89163FBEBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN-EP

  • Package Description:

    EPSOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15D

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-24

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    AND GATE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    6 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.05 µs

  • Width:

    4.89 mm

ISL89163FBEBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1995, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure optimal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement proper thermal management techniques such as heat sinking and airflow. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms if necessary.
  • Operating the ISL89163FBEBZ outside the recommended input voltage range may affect its performance, efficiency, and reliability. Using a lower input voltage may reduce the output voltage and current capability, while using a higher input voltage may increase power dissipation and reduce the device's lifespan. It's essential to consult with Renesas or a qualified engineer to determine the feasibility and potential risks of operating the device outside the recommended input voltage range.
  • To troubleshoot issues with the enable pin (EN), verify that the pin is properly connected and driven by a valid logic signal. Ensure that the EN pin is not floating or driven by an invalid voltage level. Also, check the device's datasheet for specific guidelines on EN pin operation, including the recommended pull-up resistor value and voltage levels.
  • To minimize EMI and EMC issues, follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as necessary. Additionally, ensure that the device is properly decoupled and that the input and output capacitors are selected to minimize noise and ringing. Consult with Renesas or a qualified engineer for specific guidance on EMI and EMC considerations for the ISL89163FBEBZ.

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