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ISL97684IRTZ - Renesas Electronics

Description: The ISL97682, ISL97683, ISL97684 are Renesas' highly integrated 2-3-4-channel LED drivers that are suitable for medium size TFT-LCD backlights. These parts can drive multiple channels of LEDs from inputs as low as 4V to outputs of up to 45V. They can also operate from inputs as low as 3V to outputs of up to 26. 5V in bootstrap configuration. The ISL97682, ISL97683, ISL97684 feature optional channels phase shift control. This feature is used to minimize the input, output ripple characteristics and load trans

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PCB Footprints
ISL97684IRTZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L16.3x3D 16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 3/10
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3D Models
ISL97684IRTZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L16.3x3D 16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 3/10
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ISL97684IRTZ Details

  • Manufacturer Part Number:

    ISL97684IRTZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    L16.3X3D

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    48

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    26.5 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    0.03 MHz

ISL97684IRTZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use a thermal pad on the bottom of the IC for heat dissipation.
  • Use a thermal interface material (TIM) between the IC and the heat sink, and ensure good airflow around the heat sink. Monitor the junction temperature using the thermal monitoring pin (TMP) and adjust the system design accordingly.
  • A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin and have a low inductance path to the IC.
  • Use the feedback resistors (RFBT and RFB) to set the output voltage. The recommended ratio of RFBT to RFB is 1:1.5 to 1:2.5. Adjust the resistors to achieve the desired output voltage within the specified range.
  • The maximum output current capability of the ISL97684IRTZ is 4A. However, the actual output current may be limited by the thermal design and the input voltage. Ensure the system design can handle the maximum output current and thermal dissipation.

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