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ISL9R1560S3ST - onsemi

Description: Max Forward Voltage, VF = 2.2V (@ TC = 25°C); Stealth recovery Trr = 29.4ns (@IF= 15A); RoHS compliant; Avalanche Energy Rated; 600V Reverse Voltage and High Reliability

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PCB Footprints
ISL9R1560S3ST - onsemi PCB footprint - Other - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE B
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3D Models
ISL9R1560S3ST - onsemi  - 3D model - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE B
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ISL9R1560S3ST Details

  • Manufacturer Part Number:

    ISL9R1560S3ST

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    TO-263, 3/2 PIN

  • Manufacturer Package Code:

    418AJ

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, PD-CASE, SNUBBER DIODE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    150 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

ISL9R1560S3ST Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature and adjust the design accordingly.
  • The maximum allowed voltage on the input pins is 6.5V, which is the absolute maximum rating. Operating the device above this voltage can cause damage.
  • Yes, the ISL9R1560S3ST is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's not a substitute for proper handling and protection measures.

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ISL9R1560S3ST Overview

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