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ISO1H801GAUMA1 - Infineon

Description: Coreless Transformer Isolated Digital Output 8 Channel 0.625A High-Side Switch, -50 C to 150 C

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PCB Footprints
ISO1H801GAUMA1 - Infineon PCB footprint - Other - Other - PG-DSO-36-21
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ISO1H801GAUMA1 Details

  • Manufacturer Part Number:

    ISO1H801GAUMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.430 INCH, GREEN, PLASTIC, SOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.12

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    15.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.415 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    170 µs

  • Turn-on Time:

    120 µs

  • Width:

    11 mm

ISO1H801GAUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the power source, and the input and output capacitors should be placed close to the device.
  • The device should be mounted on a heat sink with a thermal resistance of less than 10°C/W. The heat sink should be connected to a solid ground plane to ensure good thermal conductivity.
  • The maximum allowed voltage on the input pins is 6.5V. Exceeding this voltage may damage the device.
  • ESD protection should be implemented according to the IEC 61000-4-2 standard. A TVS diode or a transient voltage suppressor can be used to protect the device from electrostatic discharge.
  • A ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 10V to 16V is recommended. The capacitor should be placed as close as possible to the device.

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ISO1H801GAUMA1 Overview

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