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ISO1H811GAUMA1 - Infineon

Description: Gate Drivers DRIVER IC'S

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ISO1H811GAUMA1 - Infineon  - 3D model
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ISO1H811GAUMA1 Details

  • Manufacturer Part Number:

    ISO1H811GAUMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.430 INCH, GREEN, PLASTIC, SOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.15

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    15.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.625 A

  • Output Peak Current Limit-Nom:

    0.7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.56

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    170 µs

  • Turn-on Time:

    120 µs

  • Width:

    11 mm

ISO1H811GAUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the power source, and the input and output capacitors should be placed close to the device.
  • The device should be mounted on a heat sink with a thermal resistance of less than 10°C/W. The heat sink should be connected to a solid ground plane to ensure good thermal conductivity.
  • The maximum allowed voltage on the input pins is 6.5V. Exceeding this voltage may damage the device.
  • The device is rated for operation up to 125°C. However, the maximum junction temperature should not exceed 150°C. The device should be derated for high-temperature operation to ensure reliability.
  • Check the input and output voltages, and ensure that the device is properly cooled. Verify that the PCB layout meets the recommended guidelines. If issues persist, consult the datasheet and application notes for troubleshooting guidance.

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ISO1H811GAUMA1 Overview

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