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ISO1H812G - Infineon

Description: Smart High-Side Power Switch 0.7A SO-36 Infineon ISO1H812G, Octal Intelligent Power Switch, High Side, 0.625A, -0.5 → 6.5V, 36-Pin, DSO

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PCB Footprints
ISO1H812G - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-36_1
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3D Models
ISO1H812G - Infineon  - 3D model - Small Outline Packages - PG-DSO-36_1
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ISO1H812G Details

  • Manufacturer Part Number:

    ISO1H812G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, DSOP-36

  • Pin Count:

    36

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.12

  • Driver Number of Bits:

    8

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    36

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    2.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP36,.56

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ISO1H812G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the ISO1H812G is -40°C to 125°C.
  • To ensure EMC, follow proper PCB design guidelines, use a shielded cable, and consider adding EMI filters or common-mode chokes to the design.
  • Follow the recommended layout and routing guidelines in the datasheet, keeping sensitive analog signals away from digital signals and using a solid ground plane to reduce noise.
  • Follow the recommended power-up and power-down sequences in the datasheet to ensure proper device operation and prevent latch-up or damage.
  • Use a high-speed oscilloscope and a signal generator to test the device, and follow the recommended test and measurement methods outlined in the datasheet.

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