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ISO1H816GAUMA1 - Infineon

Description: Gate Drivers DRIVER IC'S

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PCB Footprints
ISO1H816GAUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-36-54_2021
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3D Models
ISO1H816GAUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-36-54_2021
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ISO1H816GAUMA1 Details

  • Manufacturer Part Number:

    ISO1H816GAUMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.12

  • Driver Number of Bits:

    8

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    36

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    1.2 A

  • Output Peak Current Limit-Nom:

    4.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP36,.56

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

ISO1H816GAUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the power source, and the input and output capacitors should be placed close to the device.
  • The device should be mounted on a heat sink with a thermal resistance of less than 10°C/W. The heat sink should be connected to a solid ground plane to ensure good thermal conductivity.
  • The maximum allowed voltage on the input pins is 6.5V. Exceeding this voltage may damage the device.
  • The device is rated for operation up to 125°C. However, the maximum junction temperature should not exceed 150°C. Above this temperature, the device may be damaged.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly cooled and that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guidelines.

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