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ISO2H823V25XUMA1 - Infineon

Description: Current Limit SW 8-IN 8-OUT to 1.3A 70-Pin VQFN EP T/R

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ISO2H823V25XUMA1 - Infineon PCB footprint - Other - Other - PG-VQFN-70-2 (Power PG-VQFN-70 (430 mil))
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ISO2H823V25XUMA1 - Infineon  - 3D model - Other - PG-VQFN-70-2 (Power PG-VQFN-70 (430 mil))
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ISO2H823V25XUMA1 Details

  • Manufacturer Part Number:

    ISO2H823V25XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-70

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.5

  • Additional Feature:

    INFN-O-A0004164449; PART PROCESSED WITH RESPECT TO BASE PART ISO2H823V2.5

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PQCC-N70

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    70

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.75 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Turn-off Time:

    30 µs

  • Turn-on Time:

    30 µs

  • Width:

    12 mm

ISO2H823V25XUMA1 Frequently Asked Questions (FAQs)

  • The ISO2H823V25XUMA1 can operate in a temperature range of -40°C to 125°C.
  • To ensure EMC, follow the layout and grounding guidelines provided in the datasheet, and use proper shielding and filtering techniques in your design.
  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the device's power and ground pins as close as possible to the device.
  • Follow the power-up and power-down sequences outlined in the datasheet to ensure proper device operation and prevent damage.
  • Use 100nF to 1uF decoupling capacitors with a voltage rating of 2.5V or higher, placed as close as possible to the device's power pins.

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ISO2H823V25XUMA1 Overview

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